Advanced Thermal Solutions Inc Introduction to Heat Sinks

Introduction to Heat Sinks

Advanced Thermal Solutions Inc

This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.

Related Parts

ImagenNúmero de pieza del fabricanteDescripciónCantidad disponiblePrecioVer detalles
HEAT SINK 31MM X 31MM X 19.5MMATS-51310R-C1-R0HEAT SINK 31MM X 31MM X 19.5MM0 - Inmediata$15.62Ver detalles
HEAT SINK 42.5 X 42.5 X 19.5MMATS-51425R-C1-R0HEAT SINK 42.5 X 42.5 X 19.5MM218 - Inmediata$16.29Ver detalles
HEAT SINK 19MM X 19MM X 7.5MMATS-52190B-C1-R0HEAT SINK 19MM X 19MM X 7.5MM459 - Inmediata$8.17Ver detalles
HEATSINK TO-220 W/TAB BLACKATS-PCB1049HEATSINK TO-220 W/TAB BLACK9353 - Inmediata$1.93Ver detalles
SUPERGRIP HEATSINK 19X19X7.5MMATS-X53190B-C1-R0SUPERGRIP HEATSINK 19X19X7.5MM0 - Inmediata$16.83Ver detalles
SUPERGRIP HEATSINK 23X23X12.5MMATS-X53230G-C1-R0SUPERGRIP HEATSINK 23X23X12.5MM0 - Inmediata$18.50Ver detalles
HEATSINKATS-1605-C1-R0HEATSINK461 - Inmediata$21.70Ver detalles
HEAT SINK 25MM X 25MM X 7.5MMATS-50250B-C0-R0HEAT SINK 25MM X 25MM X 7.5MM97 - Inmediata$7.57Ver detalles
HEAT SINK PASSIVE BGA SPREAD CLPATS-50250B-C3-R0HEAT SINK PASSIVE BGA SPREAD CLP66 - Inmediata$9.38Ver detalles
HEAT SINK 29X29 X 7.5MM W/O TIMATS-50290B-C0-R0HEAT SINK 29X29 X 7.5MM W/O TIM597 - Inmediata$7.70Ver detalles
HEAT SINK 29X29X12.5MM W/O TIMATS-50290G-C0-R0HEAT SINK 29X29X12.5MM W/O TIM0 - Inmediata$8.14Ver detalles
HEATSINK 29X29X17.5MM CUSTOM TIMATS-50290P-C4-R0HEATSINK 29X29X17.5MM CUSTOM TIM0 - Inmediata$9.11Ver detalles
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C0-R0HEAT SINK 31MM X 31MM X 7.5MM0 - Inmediata$8.36Ver detalles
HEATSINK 31MMX31MMX12.5MM W/O TIATS-50310G-C0-R0HEATSINK 31MMX31MMX12.5MM W/O TI0 - Inmediata$8.30Ver detalles
HEAT SINK 35MM X 35MM X 7.5MMATS-50350B-C0-R0HEAT SINK 35MM X 35MM X 7.5MM0 - Inmediata$7.82Ver detalles
HEATSINK 35MMX35MMX12.5MM W/O TIATS-50350G-C0-R0HEATSINK 35MMX35MMX12.5MM W/O TI9 - Inmediata$8.63Ver detalles
HEAT SINK 31MM X 31MM X 12.5MMATS-50350P-C3-R0HEAT SINK 31MM X 31MM X 12.5MM125 - Inmediata$11.29Ver detalles
HEATSINK 40X40X12.5MMATS-50400G-C3-R0HEATSINK 40X40X12.5MM89 - Inmediata$10.37Ver detalles
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766661 - Inmediata$9.72Ver detalles
PTM Published on: 2020-04-03

Related Videos

ATS fanSINK™ Heat Sink Family Overview
ATS fanSINK™ Heat Sink Family Overview

Fecha de publicación: 2021-11-01

How To Install The superGRIP™ Heat Sink Attachment
How To Install The superGRIP™ Heat Sink Attachment

Fecha de publicación: 2020-01-24

MEMS Oscillator ruggedness vs quartz part 2
MEMS Oscillator ruggedness vs quartz part 2

Fecha de publicación: 2018-03-13

Related Product Highlight

Gestión térmica experta de tarjetas PCIe® Los perfiles de extrusión ATS PCIe® son soluciones listas para usar específicamente para la gestión térmica de tarjetas PCIe.
Soluciones de fijación para disipadores térmicos Los accesorios del disipador térmico de Advanced Thermal Solutions brindan a los ingenieros múltiples opciones para conectar mecánicamente casi cualquier disipador térmico a las placas CI.
Enfriadores activos de alto rendimiento dualFLOW™ y quadFLOW™ ultrafríos Los enfriadores dualFLOW y quadFLOW de Advanced Thermal Solutions proporcionan al menos un 20 % de mejora en el rendimiento térmico en comparación con otros enfriadores de CPU.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

maxiFLOW Power Brick Heat Sink Technology ATS’s power brick heat sinks are engineered to create minimum pressure drop and maximize fin surface area
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.