MaxiGrip Flip Chip

maxiGRIP™ Flip-Chip

Advanced Thermal Solutions Inc

This tutorial will provide an overview of ATS’s maxiGRIP Flip-Chip including a component view, a TIM (thermal interface material) comparison, and a list of what makes the maxiGRIP unique.

Related Parts

ImagenNúmero de pieza del fabricanteDescripciónMétodo de conexiónFormaCantidad disponiblePrecioVer detalles
HEAT SINK 25.4MM X 25.4MM X 4MMATS-56002-C3-R0HEAT SINK 25.4MM X 25.4MM X 4MMCinta térmica adhesiva (incluida)Aletas cuadradas en ángulo676 - Inmediata$10.63Ver detalles
HEAT SINK 23MM X 23MM X 14.5MMATS-53230K-C1-R0HEAT SINK 23MM X 23MM X 14.5MMClip, material térmicoCuadrado, aletas920 - Inmediata$12.46Ver detalles
HEAT SINK 15MM X 15MM X 9MMATS-56003-C4-R0HEAT SINK 15MM X 15MM X 9MMCinta térmica adhesiva (no incluida)Aletas cuadradas en ángulo356 - Inmediata$14.56Ver detalles
HEAT SINK 31MM X 31MM X 9.5MMATS-53310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MMClip, material térmicoCuadrado, aletas87 - Inmediata$12.18Ver detalles
HEAT SINK 23MM X 23MM X 9.5MMATS-53230D-C1-R0HEAT SINK 23MM X 23MM X 9.5MMClip, material térmicoCuadrado, aletas695 - Inmediata$11.59Ver detalles
HEAT SINK 25MM X 25MM X 9.5MMATS-53250D-C1-R0HEAT SINK 25MM X 25MM X 9.5MMClip, material térmicoCuadrado, aletas35 - Inmediata$11.71Ver detalles
HEAT SINK 29MM X 29MM X 19.5MMATS-53290R-C1-R0HEAT SINK 29MM X 29MM X 19.5MMClip, material térmicoCuadrado, aletas565 - Inmediata$13.32Ver detalles
HEAT SINK 17MM X 17MM X 9.5MMATS-53170D-C1-R0HEAT SINK 17MM X 17MM X 9.5MMClip, material térmicoCuadrado, aletas0 - Inmediata$11.27Ver detalles
HEAT SINK 25MM X 25MM X 14.5MMATS-53250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, material térmicoCuadrado, aletas224 - Inmediata$12.58Ver detalles
HEAT SINK 19MM X 19MM X 9.5MMATS-53190D-C1-R0HEAT SINK 19MM X 19MM X 9.5MMClip, material térmicoCuadrado, aletas89 - Inmediata$11.37Ver detalles
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Fecha de publicación: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Fecha de publicación: 2012-10-15

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiFLOW™ Heat Sinks maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area. Available in a wide variety of sizes and shapes.