Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g)
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SMDSWLF.006 1G

DigiKey Part Number
315-SMDSWLF.0061G-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMDSWLF.006 1G
Description
SOLDER WIRE SN96.5/AG3/CU0.5
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g)
Datasheet
 Datasheet
Product Attributes
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Category
Diameter
0.006" (0.15mm)
Manufacturer
Chip Quik Inc.
Melting Point
423 ~ 428°F (217 ~ 220°C)
Packaging
Bulk
Flux Type
No-Clean, Water Soluble
Part Status
Active
Process
Lead Free
Type
Wire Solder
Form
Spool, 0.035 oz (1g)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
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In-Stock: 24
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Quantity
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
112,71000 €12,71 €
Manufacturers Standard Package
Unit Price without VAT:12,71000 €
Unit Price with VAT:15,37910 €
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