Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
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SMD291SNL50T3

DigiKey Part Number
SMD291SNL50T3-ND
Manufacturer
Manufacturer Product Number
SMD291SNL50T3
Description
SLDR PASTE NO-CLN SAC305 50G
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
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Category
Process
Lead Free
Manufacturer
Chip Quik Inc.
Form
Jar, 1.76 oz (50g)
Packaging
Bulk
Shelf Life
6 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Digi-Key Storage
Refrigerated
Melting Point
423 ~ 428°F (217 ~ 220°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Weight
0.113 lb (51.26 g)
Mesh Type
3
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 70
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All prices are in EUR
Bulk
QuantityUnit PriceExt Price
114,41000 €14,41 €
Manufacturers Standard Package
Unit Price without VAT:14,41000 €
Unit Price with VAT:17,43610 €