Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
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Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Thermal Tape, Adhesive (Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 2.483
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in EUR
Box
QuantityUnit PriceExt Price
12,25000 €2,25 €
101,99100 €19,91 €
251,89680 €47,42 €
501,82840 €91,42 €
1001,76230 €176,23 €
2501,67848 €419,62 €
7561,58254 €1.196,40 €
1.5121,52518 €2.306,07 €
5.2921,42656 €7.549,36 €
Manufacturers Standard Package
Unit Price without VAT:2,25000 €
Unit Price with VAT:2,72250 €