Same Sky

HSB Series BGA Heat Sinks

Same Sky's HSB series is ideal for ball grid array (BGA) applications

Image of Same Sky's BGA Heat SinksSame Sky's HSB line of BGA heat sinks support a wide range of sizes from 8.5 mm x 8.5 mm up to 69.7 mm x 69.7 mm with profiles from 5 mm to 25 mm. Made from aluminum or copper with a black anodized or clean finish, the HSB series models are measured under four conditions for thermal resistance and carry power dissipation ratings from 1.92 W to 21.74 W at +75°C. As adhesive or PCB mountable devices, Same Sky's BGA heat sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.

Resources

Features
  • Sizes from 8.5 mm x 8.5 mm up to 69.7 mm x 69.7 mm
  • Profiles from 5 mm up to 25 mm
  • Aluminum or copper with a black anodized or clean finish
  • Adhesive or PCB mounting
  • Power dissipation ratings from 1.92 W to 21.74 W at +75°C
  • Measured under four conditions for thermal resistance
Updated: 2022-06-09
Published: 2021-08-27

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