SP3222 Series Datasheet by Littelfuse Inc.

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©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/28/17
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP3222 TVS
Description
Features
Applications
The SP3222 integrates 2 channels of low capacitance
diodes to provide protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes above the maximum level specified in the
IEC61000-4-2 international standard (±30kV contact
discharge) without performance degradation. The low
loading capacitance makes it ideal for protecting high
speed data lines such as DVI, USB2.0, USB3.0 and eSATA.
ESD protection of ±30kV
contact discharge,
±30kV air discharge,
(IEC61000-4-2)
• EFT, IEC61000-4-4, 40A
(5/50ns)
Lightning protection,
IEC61000-4-5 2nd edition,
3A (tp=8/20µs)
• Low capacitance of 0.9pF
@ VR=0V (MAX)
• Space efficient 0402
(SOD883) footprint
• Extremely low dynamic
resistance (0.17Ω TYP)
• Moisture Sensitivity Level
(MSL-1)
• Halogen free, Lead free
and RoHS compliant
• USB 3.0/USB 2.0/MHL
• MIPI Camera and Display
• DisplayPort 1.3, eSATA
• Set Top Boxes, Game
Consoles
• Smart Phones
• External Storage
• Ultrabooks, Notebooks
Tablets, eReaders
• High Speed Serial
Interfaces
Functional Block Diagram
12
3
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
SP3222 0.9pF 30kV dual channel TVS
Pinout
12
SOD883
3
Bottom View
Applications Example
USB2.0
D+
D-
SP3222-02ETG
% Litleltuse“ ExpemxaADnllzd \ Anxwux Damn
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/26/17
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP3222 TVS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
component at these or any other conditions above those indicated in the operational
sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
PPK Peak Pulse Power (tP=8/20µs) 30 W
IPP Peak Current (tp=8/20μs) 3.0 A
TOP Operating Temperature -40 to 125 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 3.3 V
Forward Bias -0.9 -0.7 V
Reverse Breakdown Voltage VBR IR=1mA 6.1 8.0 9.0 V
Reverse Leakage Current ILEAK VR=3.3V 0.01 0.1 µA
Clamp Voltage1VCIPP=3A, tp=8/20µs, Fwd 10 V
Dynamic Resistance2RDYN TLP, tp=100ns, I/O to GND 0.17 Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±30 kV
IEC61000-4-2 (Air) ±30 kV
Diode Capacitance1CDReverse Bias=0V 0.9 pF
8/20μs Pulse Waveform
Note:
1 Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 200ps rise time, and average window t1=70ns to t2= 90ns
Clamping Voltage vs IPP
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.015.020.025.030.0
Time (μs)
Percent of IPP
Clamp Voltage (V )
C
Peak Pulse Current -IPP (A)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
1.0 1.5 2.0 2.5 3.0
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©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/26/17
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP3222 TVS
IEC61000−4−2 +8 kV Contact ESD Clamping Voltage IEC61000−4−2 -8 kV Contact ESD Clamping Voltage
Positive Transmission Line Pulsing (TLP) Plot
0
5
10
15
20
25
30
35
40
0 2 4 6 8 10 12 14
TLP Voltage (V)
TLP Current (A)
Negative Transmission Line Pulsing (TLP) Plot
-40
-35
-30
-25
-20
-15
-10
-5
0
-14 -12 -10 -8 -6 -4 -2 0
TLP Voltage (V)
TLP Current (A)
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
ritical Zon
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
A = Pan code = * = Date code
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/26/17
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP3222 TVS
Recommended Soldering pad layout (mm)
0.60mm
0.35mm 0.35mm
0.225mm(2x)
1.00mm
0.575mm
0.3mm
Top View
Bottom View
Side View
1 2
3
D
E
A
A1
e1
LL
b
b1
Pin1
e2
Package Dimensions — SOD883
Symbol Millimeters Inches
Min Typ Max Min Typ Max
A 0.45 0.50 0.55 0.018 0.020 0.022
A1 - 0.02 0.05 - 0.001 0.002
D 0.55 0.60 0.65 0.022 0.024 0.026
E0.95 1.00 1.05 0.037 0.039 0.041
b 0.45 0.55 0.60 0.018 0.022 0.024
b1 0.10 0.15 0.20 0.004 0.006 0.008
L0.20 0.25 0.30 0.008 0.010 0.012
e1 0.35 BSC 0.014 BSC
e2 0.65 BSC 0.026 BSC
Part Numbering System
SP 3222 02 ETG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
E: SOD883
Part Marking System
A*
A = Part code = SP3222-02ETG
= Date code
*
Part Number Package Marking Min. Order Qty.
SP3222-02ETG SOD883 A* 10000
Ordering Information
L_ Em fink—o- 8mm TAPE AND REEL wuss HD|E $‘ rum... h MHM t www.Iinel(use.mm/disclzImier-elmronics.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 06/26/17
TVS Diode Arrays (SPA
® Diodes)
Low Capacitance ESD Protection - SP3222 TVS
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimier-electronics.
Embossed Carrier Tape & Reel Specification — SOD883
A0 K0 B0
T
P2
P1
P0
D
D1
E
F
W
Symbol Millimeters
A0 0.70+/-0.05
B0 1.15+/-0.05
Dø 1.50 + 0.10
D1 ø 1.55 +/- 0.05
E1.75+/-0.10
F3.50+/-0.05
K0 0.47+/-0.05
P0 4.00+/-0.10
P1 2.00+/-0.05
P2 2.00+/-0.05
W8.00 + 0.30 -0.10
T0.20+/-0.05
W
P1
P0 P2 Φ2:1.55±0.05
E
F
A0
B0
K0
T
Top
Cover
Tape
REF
Φ:0.40±0.05
Pin1
Device OrientationinTape
R
W1
W
MN
S
H
K

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