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June 2009 Doc ID 7505 Rev 6 1/11
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STPS3L60
Power Schottky rectifier
Features
Negligible switching losses
Low forward voltage drop
Avalanche capability specified
Description
Axial and surface mount power Schottky rectifier
suited for switch mode power supplies and high
frequency dc to dc converters. Packaged in
DO-201AD, DO-15, SMB and SMBflat, this device
is intended for use in low voltage, high frequency
inverters and small battery chargers and for
applications where there are space constraints,
for example telecom battery charger.
Table 1. Device summary
IF(AV) 3 A
VRRM 60 V
Tj (max) 150 °C
VF (max) 0.61 V
K
A
K
A
K
A
K
A
SMB
STPS3L60U
DO-201AD
STPS3L60
DO-15
STPS3L60Q
SMBflat
STPS3L60UF
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Characteristics STPS3L60
2/11 Doc ID 7505 Rev 6
1 Characteristics
Table 2. Absolute ratings(1)
1. limiting values, per diode
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 60 V
IF(RMS) RMS forward current 10 A
IF(AV) Average forward current
TL = 105 °C δ = 0.5
(DO-201AD, SMB)
3A
TL = 72 °C δ = 0.5
(DO-15)
TL = 127 °C δ = 0.5
(SMBflat)
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 100 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2000 W
Tstg Storage temperature range -65 to + 150 °C
TjMaximum operating junction temperature(2)
2. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
dV/dt Critical rate of rise reverse voltage 10000 V/µs
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth (j-l) Junction to leads
SMBflat 10
°C/W
SMB 20
Lead length = 10 mm DO-201AD 20
DO-15 35
dPtot
dTj
--------------- 1
Rth j a()
--------------------------
<
nun
STPS3L60 Characteristics
Doc ID 7505 Rev 6 3/11
To evaluate the conduction losses use the following equation :
P = 0.44 x IF(AV) + 0.05 x IF2(RMS)
Table 4. Static electrical characteristics
Symbol Parameter Tests Conditions Min. Typ. Max. Unit
IR (1)
1. Pulse test :tp = 380 µs, δ < 2%
Reverse leakage current
Tj = 25 °C
VR = VRRM
--150
µA
Tj = 100 °C -415
mA
Tj = 125 °C -1430
VF (1) Forward voltage drop
Tj = 25 °C
IF = 3 A
--0.62
V
Tj = 100 °C -0.530.61
Tj = 125 °C -0.510.59
Tj = 25 °C
IF = 6 A
--0.79
Tj = 100 °C -0.620.71
Tj = 125 °C -0.60.69
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
(DO-201AD, SMB)
P (W)
F(AV)
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
T
δ=tp/T tp
I (A)
F(AV)
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
I (A)
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
R =80°C/W
th(j-a)
R=R
th(j-a) th(j-I)
T (°C)
amb
m cm g cm MUS) o m 01 1 in ma won 15 Figure 7. Non repetitive surge peak forward Figur current versus overlaad duration (maximum values) (DO-201 AD) IM(A) 11 1.5m: ma 1 am 1 ma 4/11 E
Characteristics STPS3L60
4/11 Doc ID 7505 Rev 6
Figure 3. Average forward current versus
ambient temperature (δ = 0.5)
(DO-15)
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
(SMBflat)
I (A)
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
Rth(j-a)=Rth(j-l)
Rth(j-a)=100°C/W
T (°C)
amb
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
Rth(j-a)=Rth(j-l)
Rth(j-a)=100°C/W
I (A)
F(AV)
T (°C)
amb
Figure 5. Normalized avalanche power
derating versus pulse duration
Figure 6. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-201AD)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-15)
I (A)
M
0
2
4
6
8
10
12
1.E-03 1.E-02 1.E-01 1.E+00
Ta=25°C
Ta=50°C
Ta=100°C
IM
t
δ=0.5 t(s)
0
1
2
3
4
5
6
7
8
9
10
11
1.E-03 1.E-02 1.E-01 1.E+00
Ta=25°C
Ta=50°C
Ta=100°C
IM
t
δ=0.5
I (A)
M
t(s)
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STPS3L60 Characteristics
Doc ID 7505 Rev 6 5/11
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 10. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMBflat)
0
1
2
3
4
5
6
7
8
9
10
11
1.E-03 1.E-02 1.E-01 1.E+00
Ta=25°C
Ta=50°C
Ta=100°C
IM
t
δ=0.5
I (A)
M
t(s)
0
5
10
15
20
25
30
35
40
1.E-03 1.E-02 1.E-01 1.E+00
TL=25°C
TL=50°C
TL=100°C
IM
t
δ=0.5
I (A)
M
t(s)
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-201AD)
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z/R
th(j-a) th(j-a)
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z/R
th(j-a) th(j-a)
t (s)
p
Figure 13. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 14. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMBflat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z/R
th(j-a) th(j-a)
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
Z/R
th(j-l) th(j-l)
t (s)
p
Characteristics STPS3L60
6/11 Doc ID 7505 Rev 6
Figure 15. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 16. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj=125°C
Tj=25°C
Tj=100°C
V (V)
R
I (mA)
R
10
100
1000
1 10 100
F=1MHz
Vosc=30mV
Tj=25°C
V (V)
R
C(pF)
Figure 17. Forward voltage drop versus
forward current (high level)
Figure 18. Forward voltage drop versus
forward current (low level)
0
5
10
15
20
25
30
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
0
1
2
3
4
5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
Figure 20. Thermal resistance junction to
ambient versus copper surface
under each lead (SMBflat)
0
20
40
60
80
100
120
0
.
00
.
5
1.
0
1.
5
2.
0
2.
53
.
03
.
5
4.
0
4.
55
.
0
SMB
S(Cu)(cm²)
R (°C/W)
th(j-a)
copper thickness = 35 µm
Expoxy printed circuit FR4,
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB-Flat
S(Cu)(cm²)
R (°C/W)
th(j-a)
copper thickness = 35 µm
Expoxy printed circuit FR4,
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STPS3L60 Package information
Doc ID 7505 Rev 6 7/11
2 Package information
Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 21. DO-15 plastic dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
Figure 22. DO-201AD plastic dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 9.50 0.374
B 25.40 1.000
C 5.30 0.209
D 1.30 0.051
E 1.25 0.049
Notes:
1. The lead diameter D is not controlled over zone E
2. The minimum axial length within which the device may be placed with its leads bent at
right angles is 0.59”(15 mm)
D
B
A
CC
ØC
ØD
A
EE
Note 2
Note 1 Note 1
BB
Package information STPS3L60
8/11 Doc ID 7505 Rev 6
Figure 23. SMB footprint, dimensions in mm (inches)
Table 5. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.300)
(0.064)
(0.086)
STPS3L60 Package information
Doc ID 7505 Rev 6 9/11
Figure 24. SMBflat footprint dimensions(a)
Table 6. SMBflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
a. SMB footprint may also be used.
D
A
L 2x
L
L2 2x
L1 2x
EE1
b
c
1.20
(0.047)
1.20
(0.047)
3.44
(0.136)
5.84
(0.230)
2.07
(0.082)
millimeters
(inches)
Ordering information STPS3L60
10/11 Doc ID 7505 Rev 6
3 Ordering information
4 Revision history
Table 7. Ordering information
Order codes Marking Package Weight Base qty Delivery mode
STPS3L60 STPS3L60 DO-201AD 1.12 g 600 Ammopack
STPS3L60RL STPS3L60 DO-201AD 1.12 g 1900 Tape and reel
STPS3L60Q STPS3L60 DO-15 0.4 g 1000 Ammopack
STPS3L60QRL STPS3L60 DO-15 0.4 g 6000 Tape and reel
STPS3L60U G36 SMB 0.107 g 2500 Tape and reel
STPS3L60UF FG36 SMBflat 0.136 g 5000 Tape and reel
Table 8. Document revision history
Date Revision Changes
July-2003 5A Previous issue
12-Jun-2009 6 Reformatted to current standards. Added SMBflat package.
Added ECOPACK statement. Added cathode band graphics.
STPS3L60
Doc ID 7505 Rev 6 11/11
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