Hoja de datos de LTST-C150GKT de LITEON

LITEIO] l I“ D oProELEcTHoNIcs
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
Product Data Sheet
LTST-C150GKT
Spec No. :DS-22-98-0004
Effective Date: 06/03/2020
Revision: B
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Features
* Meet ROHS, Green Product.
* Package In 8mm Tape On 7" Diameter Reels.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared And Vapor Phase Reflow Solder Process.
* EIA STD package.
* I.C. compatible.
Package Dimensions
Part No. Lens Source Color
LTST-C150GKT Water Clear GaP on GaP Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part No. : LTST-C150GKT Page : 1 of 10
BNS-OD-C131/A4
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Absolute Maximum Ratings At Ta=25℃
℃℃
℃
Parameter LTST-C150GKT
Unit
Power Dissipation 100 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA
DC Forward Current 30 mA
Derating Linear From 50°C 0.6 mA/°C
Reverse Voltage 5 V
Operating Temperature Range -55°C to + 85°C
Storage Temperature Range -55°C to + 85°C
Wave Soldering Condition 260°C For 5 Seconds
Infrared Soldering Condition 260°C For 5 Seconds
Vapor Phase Soldering Condition 215°C For 3 Minutes
Part No. : LTST-C150GKT Page : 2 of 10
BNS-OD-C131/A4
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Suggestion Profile:
(1) Suggestion IR Reflow Profile For Normal Process
(2) Suggestion IR Reflow Profile For Pb Free Process
R e c o m m e n d e d P r o file B e tw e e n A s s e m b le A n d H e a t-R e s is ta n c e L in e
T h e P ro file is a v a ila b le th a t m u s t to u s e S n A g C u s o ld e r p a s t e
Part No. : LTST-C150GKT Page : 3 of 10
BNS-OD-C131/A4
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Electrical Optical Characteristics At Ta=25℃
℃℃
℃
Parameter Symbol Part No.
LTST-
Min. Typ. Max. Unit Test Condition
Luminous Intensity IV C150GKT 1.8 6.0 mcd IF = 10mA
Note 1
Viewing Angle 2θ1/2 C150GKT 130 deg Note 2 (Fig.6)
Peak Emission Wavelength
λP C150GKT 565 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd C150GKT 569 nm Note 3
Spectral Line Half-Width Δλ C150GKT 30 nm
Forward Voltage VF C150GKT 2.1 2.6 V IF = 20mA
Reverse Current IR C150GKT 10 μA VR = 5V
Capacitance C C150GKT 35 PF VF = 0
f = 1MHZ
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
Part No. : LTST-C150GKT Page : 4 of 10
BNS-OD-C131/A4
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Bin Code List
Part No. : LTST-C150GKT Page : 5 of 10
BNS-OD-C131/A4
Luminous Intensity Unit : mcd @10mA
Bin Code Min. Max.
G 1.80 2.80
H 2.80 4.50
J 4.50 7.10
K 7.10 11.2
L 11.2 18.0
Tolerance on each Intensity bin is +/-15%
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Typical Electrical / Optical Characteristics Curves
(25 °C Ambient Temperature Unless Otherwise Noted)
Part No. : LTST-C150GKT Page : 6 of 10
BNS-OD-C131/A4
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the L
ED in ethyl alcohol or in isopropyl alcohol at normal temperature for
less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
Part No. : LTST-C150GKT Page : 7 of 10
BNS-OD-C131/A4
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
Part No. : LTST-C150GKT Page : 8 of 10
BNS-OD-C131/A4
LITEEEI CAUTIONS
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Part No. : LTST-C150GKT Page : 9 of 10
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Wave Soldering Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
120~150°C
120 sec. Max.
240°C Max.
10 sec. Max.
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Temperature
Soldering time 300°C Max.
3 sec. Max.
(one time only)
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
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Part No. : LTST-C150GKT Page : 10 of 10
BNS-OD-C131/A4
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification
Test Item
Test Condition Reference Standard
Endurance
Test
Operation Life Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
High Temperature
Storage Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008
JIS C 7021:B-10
Low Temperature
Storage Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12
Environmental
Test
Temperature
Cycling
105℃ ～ 25℃ ～ -55℃ ～ 25℃
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
10mins 10mins 10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Solder
Resistance T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
IR-Reflow
Normal Process
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:2031.2
J-STD-020
IR-Reflow
Pb Free Process
Ramp-up rate(217℃ to Peak) +3℃/ second max
Temp. maintain at 175(±25)℃ 180 seconds max
Temp. maintain above 217℃ 60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:2031.2
J-STD-020
Solderability
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.