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KyIW,
HCLGA . ALD (a x 4 x1mm)
Features
• Single supply voltage
• Low power consumption
• AOP = 122.5 dBSPL
• 64 dB signal-to-noise ratio
• Omnidirectional sensitivity
• –26 dBFS ±3 dB sensitivity
• PDM output
• HCLGA package
– Top-port design
– SMD-compliant
– EMI-shielded
– ECOPACK, RoHS, and “Green” compliant
Applications
• Mobile terminals
• Laptop and notebook computers
• Portable media players
• VoIP
• Speech recognition
• A/V eLearning devices
• Gaming and virtual reality input devices
• Digital still and video cameras
• Antitheft systems
Description
The MP34DT05-A is an ultra-compact, low-power, omnidirectional, digital MEMS
microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a
specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a
dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT05-A is a low-distortion digital microphone with a 64 dB signal-to-noise
ratio and –26 dBFS ±3 dB sensitivity.
The MP34DT05-A is available in a top-port, SMD-compliant, EMI-shielded package
and is guaranteed to operate over an extended temperature range from -40 °C to
+85 °C.
Product status link
MP34DT05-A
Product summary
Order code MP34DT05TR-A
Temperature
range [°C] -40 to +85
Package HCLGA
(3 x 4 x 1 mm) 4LD
Packing Tape and reel
MEMS audio sensor omnidirectional digital microphone
MP34DT05-A
Datasheet
DS12239 - Rev 4 - April 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Pin description
Figure 1. Pin connections
GND
CLKLR
DOUT
Vdd
BOTTOM VIEW
Table 1. Pin description
Pin # Pin name Function
1 Vdd Power supply
2 LR Left/Right channel selection
3 CLK Synchronization input clock
4 DOUT Left/Right PDM data output
5 (ground ring) GND Ground
MP34DT05-A
Pin description
DS12239 - Rev 4 page 2/17
2Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise
noted.
Table 2. Acoustic and electrical characteristics
Symbol Parameter Test condition Min. Typ.(1) Max. Unit
Vdd Supply voltage 1.6 1.8 3.6 V
Idd Current consumption in normal mode Mean value 650 µA
IddPdn Current consumption in power-down mode(2) 5 µA
Scc Short-circuit current 1 10 mA
AOP Acoustic overload point 122.5 dBSPL
So Sensitivity -29 -26 -23 dBFS
SNR Signal-to-noise ratio A-weighted @1 kHz,
94 dB SPL 64 dB(A)
PSR Power supply rejection 100 mVpp sine 1 kHz -90 dBFS
fCLK Input clock frequency(3) 1.2 2.4 3.25 MHz
Ton Turn-on time(4) Guaranteed by design 10 ms
Top Operating temperature range -40 +85 °C
VIOL Low-level logic input/output voltage Iout = 1 mA -0.3 0.35xVdd V
VIOH High-level logic input/output voltage Iout = 1 mA 0.65xVdd Vdd+0.3 V
CLOAD Capacitive load 100 pF
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.
Table 3. Distortion specifications @ 1 kHz
Parameter Test condition Typical value (1)
Distortion 94 dBSPL 0.2% THD + N
Distortion 110 dBSPL 0.7% THD + N
Distortion 120 dBSP 6% THD + N
1. Typical specifications are not guaranteed.
MP34DT05-A
Acoustic and electrical specifications
DS12239 - Rev 4 page 3/17
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2.2 Timing characteristics
Table 4. Timing characteristics
Parameter Description Min. Max. Unit
fCLK Clock frequency for normal mode 1.2 3.25 MHz
fPD Clock frequency for power-down mode 0.23 MHz
TCLK Clock period for normal mode 308 1000 ns
TR,EN Data enabled on DATA line, L/R pin = 1 40 ns
TR,DIS Data disabled on DATA line, L/R pin = 1 30 ns
TL,EN Data enabled on DATA line, L/R pin = 0 40 ns
TL,DIS Data disabled on DATA line, L/R pin = 0 30 ns
Figure 2. Timing waveforms
High Z High Z
High Z High Z
TL,EN
R,DIS
R,EN
T
L,DIS
T
T
TCLK
CLK
PDM R
PDM L
MP34DT05-A
Timing characteristics
DS12239 - Rev 4 page 4/17
202
5:71:53“
100
mm
1000
Frequency [Hz]
2.3 Frequency response
Figure 3. Typical frequency response normalized to 1 kHz
MP34DT05-A
Frequency response
DS12239 - Rev 4 page 5/17
3Application recommendations
Figure 4. MP34DT05-A electrical connections (top view)
1
2
4
3
Ground ring
5
L / R
CODEC
CLK
Dout
100nF
1µF
Vdd
TOP VIEW
Figure 5. MP34DT05-A electrical connections for stereo configuration (top view)
1
2
4
3
Ground ring
5
L / R
CODEC
CLK
Dout 1
2
4
3
Vdd
100nF
1µF
Vdd
TOP VIEW
Dout
Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin
1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection).
MP34DT05-A
Application recommendations
DS12239 - Rev 4 page 6/17
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4Carrier tape mechanical specifications
Figure 6. Carrier tape without microphone (top view)
Figure 7. Carrier tape with microphone (top view)
MP34DT05-A
Carrier tape mechanical specifications
DS12239 - Rev 4 page 7/17
I Pocket Posnlonal Tnlolanco
l Puma Slzo Tolonnco
I Pack“ Size clam-nu
I Sound Pm Posnlonal Toluene.
Q Safe Pick Area
5Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations:
• The recommended pick-up area for the MP34DT05-A package must be defined using the worst case (ie. no
device alignment during picking process). This area has been defined considering all the tolerances of the
components involved (reel, package, sound inlet). Picker tolerance shall be considered as well.
• To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the
component on the inlet area
• For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape,
size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the
picking.
• Device alignment before picking is highly recommended.
• A vacuum force greater than 7 psi must be avoided
• 1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
• MSL (moisture sensitivity level) Class 3
• Maximum of 3 reflow cycles is recommended
• All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment
tolerances
Figure 8. Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the
porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always
left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air
disturbances during the picking or placing of the devices in the tape and reel.
MP34DT05-A
Process recommendations
DS12239 - Rev 4 page 8/17
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Figure 9. Recommended picker design
MP34DT05-A
Process recommendations
DS12239 - Rev 4 page 9/17
6Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate
placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity
between those two plates.
MP34DT05-A
Sensing element
DS12239 - Rev 4 page 10/17
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7Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Table 5. Absolute maximum ratings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.3 to 5 V
Vin Input voltage on any control pin -0.3 to Vdd +0.3 V
TSTG Storage temperature range -40 to +125 °C
ESD Electrostatic discharge protection
±2000 (HBM)
V
±200 (MM)
±750 (CBM)
ESD Product standard EN 55024:2010 - 3 air discharges ±15000 V
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.
MP34DT05-A
Absolute maximum ratings
DS12239 - Rev 4 page 11/17
8Functionality
8.1 L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 6. L/R channel selection. The
L/R pin must be connected to Vdd or GND.
Table 6. L/R channel selection
L/R CLK low CLK high
GND Data valid High impedance
Vdd High impedance Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is not mandatory to
connect the pin itself to GND for the respective channel selection.
MP34DT05-A
Functionality
DS12239 - Rev 4 page 12/17
9Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
9.1 Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for
soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10. Recommended soldering profile limits
RAMP-DOWN
RAMP-UP
ts
PREHEAT
tL
tp
TLto T P
TSMAX
TSMIN
TP
TL
30 60 90 120 150 180 210 240 270 300 330 360 390
T25° to PEAK
TEMPERATURE
CRITICAL ZONE
TIME
Table 7. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate TL to TP3 °C/sec max
Preheat
Minimum temperature TSMIN 150 °C
Maximum temperature TSMAX 200 °C
Time (TSMIN to TSMAX) tS60 sec to 120 sec
Ramp-up rate TSMAX to TL
Time maintained above liquidus temperature
Liquidus temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature TP260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
MP34DT05-A
Package information
DS12239 - Rev 4 page 13/17
a 3x05' 0 950x)
045m)
W
9.2 HCLGA package information
Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
ITEM
DIMENSION [mm]
TOLERANCE [mm]
1.0± 3 ]L[ htgneL
1.0± 4 ]W[ htdiW
1.0± 00.1 ]H[ thgieH
1.0± 52.0 Ø PA
DM00231908_3
1. The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected
to thermal processes. This variation does does not affect acoustic or electrical performance.
2. Ring plating can be subject to change not affecting acoustic and electrical performance.
MP34DT05-A
HCLGA package information
DS12239 - Rev 4 page 14/17
Figure 12. Land pattern
GND
GND
GND
GND
DOUT
Vdd
CLK
LR
1.30
2.30
0.35
0.40
0.95
0.35
Pad + solder paste
0.85
0.85
MP34DT05-A
HCLGA package information
DS12239 - Rev 4 page 15/17
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
MP34DT05-A
DS12239 - Rev 4 page 17/17
