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HSEC8-1xxx-xx-xx-DV-x-xx Drawing

Samtec Inc.

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Datasheet

(0.80 mm) .0315" HSEC8-DV SERIES
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
HSEC8–125–01–L–DV–A
HSEC8–14901–L–DV–A
Mates with (1.60 mm) .062"
or (2.36 mm) .093" cards
OTHER
OPTION
HSEC8 PLATING
OPTION DV
For complete specifications and
recommended PCB layouts see
www.samtec.com?HSEC8-DV
Insulator Material:
Black Liquid Crystal Polymer
Contact:
BeCu
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.8 A per pin
(2 adjacent pins powered)
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Ye s
Notes:
While optimized for 50 W
applications, this connector
with alternative signal/ground
patterns may also perform well
in certain 75 W applications.
Some lengths, styles and
options are non-standard,
non-returnable.
1CARD
THICKNESS A
POSITIONS
PER ROW
VERTICAL EDGE RATE® CARD SOCKET
01
= (1.60 mm) .062"
thick card
–03
= (2.36 mm) .093"
thick card
For complete scope
of recognitions see
www.samtec.com/quality
SPECIFICATIONS
09, 10, 13, 20,
25, 30, 37, 40, 49,
50, 60, 70, 80, 100
(13, 25, 49 only available
with –L or –L2 option;
09 only available with –L2 option;
37 only available with –L option)
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–S
= 30 µ" (0.76 µm) Gold on contact,
Matte Tin on tail
–K
= (7.01 mm) .276" DIA
Polyimide Film
Pick & Place Pad
(with –01 card)
= (6.25 mm) .246" DIA
Polyimide Film
Pick & Place Pad
(with –03 card)
–BL
= Board Locks
(–01 card only)
(Weld tab standard)
–L
= Latching Option
(–01 card only)
(13, 25, 37, 49 only)
(Weld tab standard)
–L2
= ECDP Latching
(–01 card only)
(09, 13, 25, 49 only)
(For use with ECDP)
(Weld tab standard)
–WT
= Weld tab
–TR
= Tape & Reel
(09 - 70 only)
CABLE CONNECTOR
ECDP–04 HSEC8–109–L2
ECDP–08 HSEC8–113–L2
ECDP–16 HSEC8–125–L2
ECDP–32 HSEC8–149–L2
10, 20 & 30
01
02
01
02
(0.80) .0315
(7.80)
.307
(7.00)
.276
No. of Positions x (0.80) .0315 + (4.60) .181
No. of Positions x (0.80) .0315 + (2.20) .087
(5.60)
.220
(1.12) .044 DIA
No. of Positions x (0.80) .0315 + (7.80) .307
(No. of Positions + 6) x (0.80) .0315 + (0.60) .024
(1.32)
.052
A
B
(1.75)
.070
(7.98)
.314
09, 13, 25, 37, 100
Card Mates:
(1.60 mm) .062" card,
(2.36 mm) .093" card,
HSC8
Cable Mates:
ECDP
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (10-60)
PROCESSING
RECOGNITIONS
FILE NO. E111594
POSITIONS
PER ROW A B
09*(4.50) .177 (11.80) .465
13*(6.10) .240 (15.00) .591
25*(6.10) .240 (24.60) .969
37(18.10) .713 (34.20) 1.346
40 (18.90) .744 (36.60) 1.441
49*(22.90) .902 (43.80) 1.724
50 (22.90) .902 (44.60) 1.756
60 (26.90) 1.059 (52.60) 2.071
70(26.90) 1.059 (60.60) 2.386
80(26.90) 1.059 (68.60) 2.701
100(26.90) 1.059 (84.60) 3.331
Positions where no dimensions are given
do not have keying feature.
* Mates with ECDP Series.
Available with –01 Card Only.
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
Gbps
28
HIGH-SPEED CHANNEL PERFORMANCE
HSEC8-DV
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
F-219
MISALIGNMENT
MITIGATION
Custom designs compensate for misalignment.

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