Same Sky (Formerly CUI Devices) Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M Same Sky (Formerly CUI Devices)	1.216 In Stock	1 : 0,99000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
HSS-B20-NP-06 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	1.812 In Stock	1 : 0,34000 € Bag	HSS	Bag	Active	Board Level	TO-220	Bolt On	Square, Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.375" (9.52mm)	2.9W @ 75°C	7.51°C/W @ 200 LFM	26.32°C/W	Aluminum	Black Anodized
HSS-B20-0953H-02 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	1.522 In Stock	1 : 0,42000 € Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.500" (12.70mm)	0.504" (12.80mm)	-	0.748" (19.00mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum	Black Anodized
HSS-B20-0635H-01 HEATSINK TO-220 2.7W ALUMINUM Same Sky (Formerly CUI Devices)	9.889 In Stock	1 : 0,45000 € Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.375" (9.53mm)	-	0.748" (19.00mm)	2.7W @ 75°C	9.51°C/W @ 200 LFM	27.78°C/W	Aluminum	Black Anodized
HSS-B20-0635H-02 HEATSINK TO-220 2.6W ALUMINUM Same Sky (Formerly CUI Devices)	4.348 In Stock	1 : 0,47000 € Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.500" (12.70mm)	-	0.748" (19.00mm)	2.6W @ 75°C	10.49°C/W @ 200 LFM	29.09°C/W	Aluminum	Black Anodized
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	6.660 In Stock	1 : 0,51000 € Box	HSE	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.354" (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy	Black Anodized
HSS-B20-NP-04 HEATSINK TO-220 6.5W ALUMINUM Same Sky (Formerly CUI Devices)	5.304 In Stock	1 : 0,58000 € Box	HSS	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.370" (9.40mm)	6.5W @ 75°C	3.76°C/W @ 200 LFM	11.54°C/W	Aluminum	Black Anodized
HSS-B20-NPR-02 HEATSINK TO-220 5.1W ALUMINUM Same Sky (Formerly CUI Devices)	1.902 In Stock	1 : 0,59000 € Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum	Black Anodized
HSS-B20-NP-12 HEATSINK TO-220 6.8W ALUMINUM Same Sky (Formerly CUI Devices)	1.689 In Stock	1 : 0,61000 € Bag	HSS	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.700" (17.80mm)	-	0.850" (21.60mm)	6.8W @ 75°C	3.47°C/W @ 200 LFM	14.33°C/W	Aluminum	Black Anodized
HSS-B20-CP-01 HEATSINK TO-220 2.6W ALUMINUM Same Sky (Formerly CUI Devices)	1.479 In Stock	1 : 0,68000 € Box	HSS	Box	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.375" (9.53mm)	0.900" (22.86mm)	-	0.740" (18.79mm)	2.6W @ 75°C	6.32°C/W @ 200 LFM	28.85°C/W	Aluminum	Black Anodized
HSB04-171706 HEAT SINK, BGA, 17 X 17 X 6 MM Same Sky (Formerly CUI Devices)	1.917 In Stock	1 : 0,72000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	2.5W @ 75°C	13.10°C/W @ 200 LFM	29.73°C/W	Aluminum Alloy	Black Anodized
HSS-B20-061H HEATSINK TO-220 4W ALUMINUM Same Sky (Formerly CUI Devices)	1.434 In Stock	1 : 0,75000 € Box	HSS	Box	Active	Board Level	TO-220	PC Pin	Rectangular, Fins	1.500" (38.10mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum	Black Anodized
HSB31-212105 HEAT SINK, BGA, 21 X 21 X 5 MM Same Sky (Formerly CUI Devices)	1.682 In Stock	1 : 0,75000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.197" (5.00mm)	3.0W @ 75°C	9.90°C/W @ 200 LFM	25.33°C/W	Aluminum Alloy	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices)	2.325 In Stock	1 : 0,78000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized
HSS-B20-0503H HEATSINK TO-220 4.6W ALUMINUM Same Sky (Formerly CUI Devices)	1.961 In Stock	1 : 0,81000 € Box	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	4.6W @ 75°C	5.44°C/W @ 200 LFM	16.30°C/W	Aluminum	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM Same Sky (Formerly CUI Devices)	2.633 In Stock	1 : 0,81000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
HSE04-251265-1 HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices)	1.352 In Stock	1 : 0,86000 € Bag	HSE	Bag	Active	Top Mount	TO-218, TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.472" (12.00mm)	-	0.256" (6.50mm)	2.4W @ 75°C	16.30°C/W @ 200 LFM	31.22°C/W	Aluminum Alloy	Black Anodized
HSE-B20350-NP HEAT SINK, EXTRUSION, TO-220, 35 Same Sky (Formerly CUI Devices)	1.157 In Stock	1 : 0,87000 € Tray	HSE	Tray	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.378" (35.00mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	6.2W @ 75°C	2.91°C/W @ 200 LFM	12.10°C/W	Aluminum Alloy	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	3.593 In Stock	1 : 0,91000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices)	1.925 In Stock	1 : 0,93000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.709" (18.00mm)	0.709" (18.00mm)	-	0.394" (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy	Black Anodized
HSE-B254-04H HEAT SINK, EXTRUSION, TO-220/TO- Same Sky (Formerly CUI Devices)	612 In Stock	1 : 0,93000 € Box	HSE	Box	Active	Board Level, Vertical	TO-218, TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	0.650" (16.50mm)	-	0.630" (16.00mm)	4.7W @ 75°C	4.93°C/W @ 200 LFM	15.96°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-035H-01 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	3.812 In Stock	1 : 0,97000 € Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.000" (25.40mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	5.2W @ 75°C	4.42°C/W @ 200 LFM	14.42°C/W	Aluminum Alloy	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	973 In Stock	1 : 1,07000 € Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	703 In Stock	1 : 1,09000 € Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM Same Sky (Formerly CUI Devices)	2.056 In Stock	1 : 1,16000 € Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized

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Heat Sinks

Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.

Heat Sinks

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