Copper Heat Sinks

Results: 153
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCComair RotronCooling SourceCUI DevicesDFRobotMalico Inc.Seeed Technology Co., LtdSparkFun Electronicst-Global TechnologyWakefield-Vette
Series
-208217218261268286CS266dualFLOW™HBAHBHHSB
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalHeat Spreader Kit, Top MountHeat SpreaderTop Mount with FanTop MountTop Mount, SkivedTop Mount, Zipper Fin
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)Axial Lead DevicesBGABGA, FPGAD²Pak (TO-263), SOL-20, SOT-223, TO-220Intel LGA1150 & LGA1155 & LGA1156 CPU CoolerIntel LGA2011 & LGA2066 & LGA1366 CPU CoolerIntel LGA2011 & LGA2066 CPU CoolerIntel LGA2011 CPU CoolerIntel® Xeon® CPUMultiwatt, SIP
Attachment Method
-AdhesiveBolt On and Board MountsBolt On and PC PinBolt OnClip and Board LocksClip and Board MountsClip and PC PinClipClip, Thermal Tape, Adhesive (Not included)PC PinPush PinPush Pin, Thermal MaterialSMD Pad
Shape
RectangularRectangular, FinsSquareSquare, FinsSquare, Pin Fins
Length
0.315" (8.00mm)0.320" (8.13mm)0.394" (10.00mm)0.500" (12.70mm)0.520" (13.20mm)0.551" (14.00mm)0.591" (15.00mm)0.700" (17.78mm)0.740" (18.80mm)0.750" (19.05mm)0.763" (19.38mm)0.780" (19.81mm)
Width
0.250" (6.35mm)0.375" (9.53mm)0.394" (10.00mm)0.476" (12.10mm)0.480" (12.19mm)0.500" (12.70mm)0.520" (13.21mm)0.551" (14.00mm)0.591" (15.00mm)0.600" (15.24mm)0.750" (19.05mm)0.790" (20.07mm)
Fin Height
0.002" (0.06mm)0.003" (0.07mm)0.008" (0.21mm)0.041" (1.05mm)0.157" (4.00mm)0.189" (4.80mm)0.250" (6.35mm)0.275" (7.00mm)0.276" (7.00mm)0.307" (7.80mm)0.354" (9.00mm)0.360" (9.14mm)
Power Dissipation @ Temperature Rise
0.5W @ 20°C0.6W @ 30°C1.0W @ 20°C1.0W @ 30°C1.0W @ 50°C1.0W @ 55°C1.3W @ 30°C1.5W @ 20°C1.5W @ 40°C1.5W @ 50°C2.0W @ 30°C2.0W @ 40°C
Thermal Resistance @ Forced Air Flow
0.80°C/W @ 300 LFM1.20°C/W @ 200 LFM1.30°C/W @ 200 LFM1.40°C/W @ 200 LFM1.65°C/W @ 200 LFM1.70°C/W @ 200 LFM1.90°C/W @ 200 LFM2.10°C/W @ 200 LFM2.50°C/W @ 200 LFM2.60°C/W @ 200 LFM2.90°C/W @ 200 LFM3.00°C/W @ 300 LFM
Thermal Resistance @ Natural
4.50°C/W5.10°C/W5.60°C/W7.00°C/W7.20°C/W7.70°C/W8.00°C/W8.30°C/W8.90°C/W10.05°C/W11.00°C/W12.50°C/W
Material Finish
-AavSHIELD 3CBlack AnodizedBlack CoatingBlack PaintClean FinishedNickelPolyesterRed AnodizedTinTin, Black Paint
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V-1100-SMD/A-L
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
3.908
In Stock
1 : 0,45000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
6.764
In Stock
1 : 0,61000 €
Cut Tape (CT)
400 : 0,49193 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
6025DG
6025DG
HEATSINK TO-220 STAGGEREDFIN TIN
Boyd Laconia, LLC
2.928
In Stock
1 : 1,47000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.250" (31.75mm)
0.875" (22.23mm)
-
0.250" (6.35mm)
3.0W @ 60°C
7.00°C/W @ 400 LFM
17.90°C/W
Copper
Tin
7106DG
7106DG
BOARD LEVEL HEATSINK .375" D2PAK
Boyd Laconia, LLC
10.937
In Stock
1 : 1,81000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10
SMD Pad
Rectangular, Fins
0.591" (15.00mm)
1.020" (25.91mm)
-
0.375" (9.52mm)
2.0W @ 40°C
5.00°C/W @ 400 LFM
-
Copper
Tin
7109D/TRG
7109D/TRG
HEATSINK TO-263 (D2PK)
Boyd Laconia, LLC
17.989
In Stock
1 : 1,84000 €
Cut Tape (CT)
125 : 1,54856 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
7109DG
7109DG
TOP MOUNT HEATSINK .45" D2PAK
Boyd Laconia, LLC
5.447
In Stock
1 : 3,18000 €
Bag
-
Bag
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
6030B-TTG
6030B-TTG
THM,10594B-TT REV BB(COPPER)G
Boyd Laconia, LLC
225
In Stock
1 : 4,20000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
-
-
-
Copper
Tin, Black Paint
32
In Stock
1 : 145,97000 €
Box
-
Box
Active
Top Mount, Skived
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.543" (90.00mm)
3.543" (90.00mm)
-
1.102" (28.00mm)
-
-
-
Copper
Nickel
95
In Stock
1 : 148,06000 €
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Copper
Nickel
217-36CTE6
217-36CTE6
HEATSINK DPAK SMT TIN PLATED
Wakefield-Vette
11.017
In Stock
1 : 0,50000 €
Bulk
Bulk
Active
Top Mount
D²Pak (TO-263), SOL-20, SOT-223, TO-220
SMD Pad
Rectangular, Fins
0.740" (18.80mm)
0.600" (15.24mm)
-
0.360" (9.14mm)
1.0W @ 55°C
16.00°C/W @ 200 LFM
55.00°C/W
Copper
Tin
116.781
In Stock
1 : 0,77000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.402" (10.21mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
7173DG
7173DG
BOARD LEVEL HEATSINK .375"TO-220
Boyd Laconia, LLC
6.041
In Stock
1 : 1,10000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.375" (9.52mm)
1.5W @ 50°C
10.00°C/W @ 200 LFM
25.80°C/W
Copper
Tin
573400D00010(G)
573400D00010G
HEATSINK D-PAK3 TIN PLATED SMD
Boyd Laconia, LLC
1.851
In Stock
1 : 1,10000 €
Cut Tape (CT)
250 : 0,88104 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-268 (D³Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.220" (30.99mm)
-
0.401" (10.20mm)
1.0W @ 20°C
4.00°C/W @ 600 LFM
14.00°C/W
Copper
Tin
7139DG
7139DG
HEATSINK TO-220 TIN CLIP-ON 13MM
Boyd Laconia, LLC
5.673
In Stock
1 : 1,26000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Clip and PC Pin
Rectangular, Fins
0.780" (19.81mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.5W @ 50°C
8.00°C/W @ 500 LFM
28.30°C/W
Copper
Tin
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
6.552
In Stock
1 : 1,27000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
6030D(COPPER)G
6030D(COPPER)G
BOARD LEVEL HEAT SINK
Boyd Laconia, LLC
1.446
In Stock
1 : 1,31000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
1.0W @ 20°C
6.00°C/W @ 300 LFM
12.50°C/W
Copper
Tin
7.727
In Stock
1 : 1,36000 €
Cut Tape (CT)
250 : 1,08940 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.401" (10.20mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
7136DG
7136DG
BOARD LEVEL HEATSINK .515"TO-220
Boyd Laconia, LLC
1.831
In Stock
1 : 3,67000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.848" (21.55mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.0W @ 30°C
6.00°C/W @ 500 LFM
19.70°C/W
Copper
Tin
7138DG
7138DG
BOARD LEVEL HEAT SINK
Boyd Laconia, LLC
1.531
In Stock
1 : 6,97000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
1.025" (26.04mm)
1.005" (25.53mm)
-
0.610" (15.49mm)
1.5W @ 40°C
5.00°C/W @ 500 LFM
20.00°C/W
Copper
Tin
342941
342941
COPPER HEATSINK 40X40.5X13.5MM
Boyd Laconia, LLC
226
In Stock
1 : 32,54000 €
Tray
-
Tray
Active
Top Mount, Skived
BGA
Push Pin
Square, Fins
1.594" (40.50mm)
1.575" (40.00mm)
-
0.531" (13.50mm)
-
2.50°C/W @ 200 LFM
13.30°C/W
Copper
AavSHIELD 3C
342949
342949
COPPER HEATSINK 80X80X12MM
Boyd Laconia, LLC
177
In Stock
1 : 57,14000 €
Tray
-
Tray
Active
Top Mount, Skived
BGA
Push Pin
Square, Fins
3.150" (80.00mm)
3.150" (80.00mm)
-
0.472" (12.00mm)
-
1.20°C/W @ 200 LFM
5.10°C/W
Copper
AavSHIELD 3C
88
In Stock
1 : 209,96000 €
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Copper
Nickel
2.591
In Stock
1 : 0,87000 €
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
-
Rectangular, Fins
0.315" (8.00mm)
0.842" (21.40mm)
-
0.400" (10.16mm)
-
21.00°C/W @ 200 LFM
28.00°C/W
Copper
Tin
7142DG
7142DG
HEATSINK TO-220 TIN CLIP-ON 21MM
Boyd Laconia, LLC
5.375
In Stock
1 : 0,96000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Clip and Board Locks
Rectangular, Fins
0.780" (19.81mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.0W @ 30°C
8.00°C/W @ 400 LFM
20.30°C/W
Copper
Tin
929
In Stock
1 : 1,36000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
1.252" (31.80mm)
0.913" (23.20mm)
-
0.041" (1.05mm)
-
14.00°C/W @ 200 LFM
23.00°C/W
Copper
Tin
Showing
of 153

Copper Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.