Copper Heat Sinks

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
21.659
In Stock
1 : 0,50000 €
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1100-SMD/A-L
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
17.284
In Stock
1 : 0,51000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
73.470
In Stock
1 : 0,69000 €
Cut Tape (CT)
400 : 0,49810 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
4.548
In Stock
1 : 1,43000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
-
23.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
11.043
In Stock
1 : 1,49000 €
Cut Tape (CT)
250 : 1,11528 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.401" (10.20mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
7109D/TRG
7109D/TRG
HEATSINK TO-263 (D2PK)
Boyd Laconia, LLC
2.962
In Stock
1 : 1,96000 €
Cut Tape (CT)
125 : 1,51576 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
7106DG
7106DG
BOARD LEVEL HEATSINK .375" D2PAK
Boyd Laconia, LLC
9.416
In Stock
1 : 2,60000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10
SMD Pad
Rectangular, Fins
0.591" (15.00mm)
1.020" (25.91mm)
-
0.375" (9.52mm)
2.0W @ 40°C
5.00°C/W @ 400 LFM
-
Copper
Tin
6030B-TTG
6030B-TTG
THM,10594B-TT REV BB(COPPER)G
Boyd Laconia, LLC
278
In Stock
1 : 4,06000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
-
-
-
Copper
Tin, Black Paint
6025DG
6025DG
HEATSINK TO-220 STAGGEREDFIN TIN
Boyd Laconia, LLC
2.906
In Stock
1 : 4,23000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.250" (31.75mm)
0.875" (22.22mm)
-
0.250" (6.35mm)
3.0W @ 60°C
7.00°C/W @ 400 LFM
17.90°C/W
Copper
Tin
7109DG
7109DG
TOP MOUNT HEATSINK .45" D2PAK
Boyd Laconia, LLC
2.102
In Stock
1 : 4,57000 €
Bag
-
Bag
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
46
In Stock
1 : 131,53000 €
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Copper
Nickel
71
In Stock
1 : 152,67000 €
Box
-
Box
Active
Top Mount, Skived
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.543" (90.00mm)
3.543" (90.00mm)
-
1.102" (28.00mm)
-
-
-
Copper
Nickel
217-36CTE6
217-36CTE6
HEATSINK DPAK SMT TIN PLATED
Wakefield-Vette
6.675
In Stock
1 : 0,49000 €
Bulk
Bulk
Active
Top Mount
D²Pak (TO-263), SOL-20, SOT-223, TO-220
SMD Pad
Rectangular, Fins
0.740" (18.80mm)
0.600" (15.24mm)
-
0.360" (9.14mm)
1.0W @ 55°C
16.00°C/W @ 200 LFM
55.00°C/W
Copper
Tin
217-36CTRE6
217-36CTRE6
BOARD LEVEL HEAT SINKS
Wakefield-Vette
7.058
In Stock
1 : 0,61000 €
Cut Tape (CT)
250 : 0,45040 €
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
D²Pak (TO-263), SOL-20, SOT-223, TO-220
SMD Pad
Rectangular, Fins
0.740" (18.80mm)
0.600" (15.24mm)
-
0.360" (9.14mm)
1.0W @ 55°C
16.00°C/W @ 200 LFM
55.00°C/W
Copper
Tin
FIT0367
FIT0367
RASPBERRY PI COPPER HEATSINK
DFRobot
1.236
In Stock
1 : 0,87000 €
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.476" (12.10mm)
-
-
-
-
-
Copper
-
7173DG
7173DG
BOARD LEVEL HEATSINK .375"TO-220
Boyd Laconia, LLC
3.734
In Stock
1 : 0,93000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.375" (9.52mm)
1.5W @ 50°C
10.00°C/W @ 200 LFM
25.80°C/W
Copper
Tin
2.605
In Stock
1 : 0,95000 €
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
-
Rectangular, Fins
0.315" (8.00mm)
0.842" (21.40mm)
-
0.400" (10.16mm)
-
21.00°C/W @ 200 LFM
28.00°C/W
Copper
Tin
116.305
In Stock
1 : 1,05000 €
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
-
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.402" (10.21mm)
-
9.50°C/W @ 200 LFM
18.00°C/W
Copper
Tin
7139DG
7139DG
HEATSINK TO-220 TIN CLIP-ON 13MM
Boyd Laconia, LLC
6.957
In Stock
1 : 1,24000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Clip and PC Pin
Rectangular, Fins
0.780" (19.81mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.5W @ 50°C
8.00°C/W @ 500 LFM
28.30°C/W
Copper
Tin
7142DG
7142DG
HEATSINK TO-220 TIN CLIP-ON 21MM
Boyd Laconia, LLC
4.296
In Stock
1 : 1,34000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Clip and Board Locks
Rectangular, Fins
0.780" (19.81mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.0W @ 30°C
8.00°C/W @ 400 LFM
20.30°C/W
Copper
Tin
ATS-PCB1060
ATS-PCB1060
HEATSINK TO-220 COPPER W/TAB
Advanced Thermal Solutions Inc.
981
In Stock
1 : 3,24000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and Board Mounts
Rectangular, Fins
0.858" (21.80mm)
0.520" (13.21mm)
-
0.510" (12.95mm)
-
8.00°C/W @ 200 LFM
19.70°C/W
Copper
Tin
573400D00010(G)
573400D00010G
HEATSINK D-PAK3 TIN PLATED SMD
Boyd Laconia, LLC
2.267
In Stock
1 : 3,37000 €
Cut Tape (CT)
250 : 2,51056 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-268 (D³Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.220" (30.99mm)
-
0.401" (10.20mm)
1.0W @ 20°C
4.00°C/W @ 600 LFM
14.00°C/W
Copper
Tin
7128DG
7128DG
BOARD LEVEL HEATSINK .375"TO-220
Boyd Laconia, LLC
2.069
In Stock
1 : 3,46000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
1.100" (27.94mm)
0.866" (22.00mm)
-
0.375" (9.52mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
19.20°C/W
Copper
Tin
FIT0506
FIT0506
PURE COPPER HEATSINK PACK OF 5 (
DFRobot
111
In Stock
1 : 3,96000 €
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.480" (12.19mm)
-
0.189" (4.80mm)
-
-
-
Copper
-
7141dg
7141DG
BOARD LEVEL HEATSINK .515"TO-220
Boyd Laconia, LLC
3.309
In Stock
1 : 4,02000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.780" (19.81mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.0W @ 30°C
10.00°C/W @ 200 LFM
20.30°C/W
Copper
Tin
Showing
of 407

Copper Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.