ESD108-B1-CSP0201 Datasheet by Infineon Technologies

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ESD108-B1-CSP0201
Protection device
TVS (transient voltage suppressor)
Bi-directional, 5.5 V, 0.28 pF, 0201, RoHS and halogen free compliant
Features
ESD/transient protection of high speed data lines according to:
- IEC61000-4-2 (ESD): ±25 kV (air/contact discharge)
- IEC61000-4-4 (EFT): ±2.5 kV/±50 A (5/50 ns)
- IEC61000-4-5 (Surge): ±2.5 A (8/20 μs)
Bi-directional working voltage up to: VRWM = ±5.5 V
Line capacitance: CL = 0.28 pF (typical) at f = 1 MHz
Clamping voltage: VCL = 20 V (typical) at ITLP = 16 A with RDYN = 0.78 Ω (typical)
Very low reverse current: IR < 1 nA (typical)
Small form factor SMD size 0201 and low profile (0.58 mm x 0.28 mm x 0.15 mm);
for further package information please refer to application note AN392 [4]
Bi-directional and symmetric I/V characteristics for optimized design/assembly
Potential applications
USB 3.0, Firewire, DVI, HDMI, S-ATA, DisplayPort, Thunderbolt
Mobile HDMI Link, MDDI, MIPI, SWP / NFC
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22
Device information
a) Pin configuration b )
Schematic diagram
Figure 1 Pin configuration and schematic diagram
Table 1 Part information
Type Package Configuration Marking code
ESD108-B1-CSP0201 WLL-2-1 1 line, bi-directional C 1)
1The device has no marking or date code on the device backside. The marking code is on pad side.
Datasheet Please read the Important Notice and Warnings at the end of this document Revision 1.5
www.infineon.com 2017-10-17
®
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Typical characteristic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 WLL-2-1 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ESD108-B1-CSP0201
Protection device
Table of contents
Datasheet 2 Revision 1.5
2017-10-17
®
1 Maximum ratings
Note:TA = 25 °C, unless otherwise specified.
Table 2 Maximum ratings
Parameter Symbol Values Unit Note or test condition
Reverse working voltage VRWM ±5.5 V –
ESD (air/contact) discharge 1) VESD ±25 kV –
Reverse working current IRWM 10 mA –
Peak pulse power PPK 27.5 W tp = 8/20 μs2)
18 kW tp = 100 ns 1)
Peak pulse current 2) IPP ±2.5 A –
Operating temperature range TOP -55 to 125 °C
Storage temperature Tstg -65 to 150 °C
Attention:Stresses above the maximum values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings. Exceeding only one of these values may cause
irreversible damage to the component.
Table 3 Thermal resistance
Parameter Symbol Values Unit Note or test condition
Min. Typ. Max.
Junction - soldering point 3) RthJS 330 K/W –
1VESD according to IEC61000-4-2 (R = 330 Ω, C = 150 pF discharge network)
2Stress pulse: 8/20 μs current waveform according to IEC61000-4-5
3For calculation of RthJA please refer to application note AN077 [3]: Thermal resistance calculation
ESD108-B1-CSP0201
Protection device
Maximum ratings
Datasheet 3 Revision 1.5
2017-10-17
®
2 Electrical characteristics
Note:TA = 25 °C, unless otherwise specified. Device is electrically symmetrical.
Vt1
VF
Vh
VRWM
IR
ΔV
ΔI
RDYN
ΔV
ΔI
ITLP
VR
IF
IR
IPP
VCL
VTLP
ITLP
IPP
IR
VRWM
Vt1 Vh
VCL
VTLP
ΔV
ΔI
RDYN
ΔV
ΔI
VF... Forward voltage
VR... Reverse voltage
IR... Reverse current
IF... Forward current
Diode_Characteristic_Curve_with_snapback_Bi-directional.svg
IT
IT
RDYN ... Dynamic resistance
VRWM ... Reverse working voltage max.
Vt1 ... Trigger voltage
Vh ... Holding voltage
VCL ... Clamping voltage
VTLP ... TLP voltage
IR ... Reverse leakage current
Ipp ... Peak pulse current
ITLP ... TLP current
IT ... Test current
Figure 2 Definitions of electrical characteristics
ESD108-B1-CSP0201
Protection device
Electrical characteristics
Datasheet 4 Revision 1.5
2017-10-17
®
Table 4 DC characteristics
Parameter Symbol Values Unit Note or test condition
Min. Typ. Max.
Reverse current IR <1 20 nA VR = ±5.5 V
Trigger voltage Vt1 9.5 12.5 V
Holding voltage Vh5.5 6.5 9.5 V IT = 0.5 mA
Table 5 AC characteristics
Parameter Symbol Values Unit Note or test condition
Min. Typ. Max.
Line capacitance CL 0.28 0.38 pF VR = 0 V, f = 1 MHz
0.22 0.38 VR = 0 V, f = 1 GHz
Table 6 ESD and Surge characteristics
Parameter Symbol Values Unit Note or test condition
Min. Typ. Max.
Clamping voltage 1) VCL 20 27 V ITLP = 16 A, tp = 100 ns
30.5 41 ITLP = 30 A, tp = 100 ns
Clamping voltage2) 20 – VESD = 8 kV
29 – VESD = 15 kV
Clamping voltage 3) 8.5 12 IPP = 1 A, tp = 8/20 µs
11 18.5 IPP = 2.5 A, tp = 8/20 µs
Dynamic resistance 1) RDYN 0.78 tp = 100 ns
1Please refer to application note AN210 [1], TLP parameters: Z0 = 50 Ω , tp = 100 ns, tr = 0.6 ns
2VESD according to IEC61000-4-2 (contact discharge), VCL at 30 ns (R = 330 Ω, C = 150 pF discharge network)
3Stress pulse: 8/20 μs current waveform according to IEC61000-4-5
ESD108-B1-CSP0201
Protection device
Electrical characteristics
Datasheet 5 Revision 1.5
2017-10-17
®
3 Typical characteristic diagrams
Note:TA = 25 °C, unless otherwise specified.
10-13
10-12
10-11
10-10
10-9
10-8
10-7
10-6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
IR [A]
VR [V]
Figure 3 Reverse leakage current: IR = f(VR)
100
150
200
250
300
350
400
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
CL [fF]
VR [V]
1 MHz
1 GHz
Figure 4 Line capacitance: CL = f(VR)
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 6 Revision 1.5
2017-10-17
®
0
2
4
6
8
10
12
14
0 50 100 150
IRWM [mA]
TS, TA [°C]
TATS
Figure 5 Reverse working current IRWM = f(TS, TA), device mounted on PCB with Rth = 200 K/W [3]
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 7 Revision 1.5
2017-10-17
®
-25
0
25
50
75
100
125
150
175
-50 0 50 100 150 200 250 300 350 400 450
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = 141 V
VCL-30ns-peak = 20 V
Figure 6 Clamping voltage (ESD): VCL = f(t), 8 kV positive pulse (according to IEC61000-4-2)
-175
-150
-125
-100
-75
-50
-25
0
25
-50 0 50 100 150 200 250 300 350 400 450
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = -137 V
VCL-30ns-peak = -16 V
Figure 7 Clamping voltage (ESD): VCL = f(t), 8 kV negative pulse (according to IEC61000-4-2)
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 8 Revision 1.5
2017-10-17
®
-25
0
25
50
75
100
125
150
175
-50 0 50 100 150 200 250 300 350 400 450
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = 165 V
VCL-30ns-peak = 29 V
Figure 8 Clamping voltage (ESD): VCL = f(t), 15 kV positive pulse (according to IEC61000-4-2)
-175
-150
-125
-100
-75
-50
-25
0
25
-50 0 50 100 150 200 250 300 350 400 450
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = -162 V
VCL-30ns-peak = -27 V
Figure 9 Clamping voltage (ESD): VCL = f(t), 15 kV negative pulse (according to IEC61000-4-2)
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 9 Revision 1.5
2017-10-17
®
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
-50 -40 -30 -20 -10 0 10 20 30 40 50
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
ITLP [A]
Equivalent VIEC [kV]
VTLP [V]
ESD108-B1-CSP0201
RDYN
RDYN = 0.78
RDYN = 0.78
Figure 10 Clamping voltage (TLP): ITLP = f(VTLP) [1]
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 10 Revision 1.5
2017-10-17
®
-3
-2
-1
0
1
2
3
-15 -10 -5 0 5 10 15
IPP [A]
VCL [V]
Figure 11 Clamping voltage (Surge): IPP = f(VCL) (according to IEC61000-4-5) [1]
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 11 Revision 1.5
2017-10-17
(ifineon Insertion Loss [dB] f [GHZ]
-6
-5
-4
-3
-2
-1
0
0.1 1 10
Insertion Loss [dB]
f [GHz]
Figure 12 Insertion loss vs. frequency in a 50 Ω system
ESD108-B1-CSP0201
Protection device
Typical characteristic diagrams
Datasheet 12 Revision 1.5
2017-10-17
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4 Package information
4.1 WLL-2-1 package
Note:Dimensions in mm.
SG-WLL-2-1-PO V01
±0.03
0.28
±0.01
0.15
1
2
±0.02
0.2
0.58
±0.03
±0.02
0.26
Bottom viewTop view
0.36
(0.16)
Figure 13 WLL-2-1 package outline
0.27
0.19
0.19
0.19
Copper Solder mask Stencil apertures
0.57
0.24
0.62
0.32
0.24
0.14
SG-WLL-2-1-FP V01
Figure 14 WLL-2-1 footprint (recommendation for printed circuit board assembly see [2])
Figure 15 WLL-2-1 packing
Figure 16 WLL-2-1 marking example (see Device information)
ESD108-B1-CSP0201
Protection device
Package information
Datasheet 13 Revision 1.5
2017-10-17
®
5 References
[1] Infineon AG - Application note AN210: Effective ESD protection design at system level using VF-TLP
characterization methodology
[2] Infineon AG - Recommendation for Printed Circuit Board Assembly of Infineon WLL Packages
http://www.infineon.com/Packageinformation_WLL
[3] Infineon AG - Application note AN077: Thermal resistance calculation
[4] Infineon AG - Application note AN392: TVS diodes in ChipScalePackage reduce size and save cost
Revision history
Revision history: Rev. 1.4, 2016-04-21
Page or Item Subjects (major changes since previous revision)
Revision 1.5, 2017-10-17
All Data sheet layout changed, references updated
ESD108-B1-CSP0201
Protection device
References
Datasheet 14 Revision 1.5
2017-10-17
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2017-10-17
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2017 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-nym1501066509051
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values
stated herein and/or any information regarding the
application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of
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third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
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dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
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