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PESD2CAN Datasheet

Nexperia USA Inc.

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Datasheet

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Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
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reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
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1. Product profile
1.1 General description
PESD2CAN in a small SOT23 Surface-Mounted Device (SMD) plastic package designed
to protect two automotive Controller Area Network (CAN) bus lines from the damage
caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features and benefits
Max. peak pulse power: PPP =230W at t
p=8/20s
Low clamping voltage: VCL =41V at I
PP =5A
Ultra low leakage current: IRM <1nA
ESD protection up to 30 kV
IEC 61000-4-2, level 4 (ESD)
IEC 61000-4-5 (surge); IPP =5A at t
p=8/20s
AEC-Q101 qualified
1.3 Applications
CAN bus protection
Automotive applications
1.4 Quick reference data
2. Pinning information
PESD2CAN
CAN bus ESD protection diode
Rev. 2 — 27 September 2012 Product data sheet
SOT23
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage - - 24 V
Cddiode capacitance f = 1 MHz; VR= 0 V - 25 30 pF
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode 1
2 cathode 2
3 common cathode
12
3
2
1
006aaa155
3
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 2 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
3. Ordering information
4. Marking
[1] * = placeholder for manufacturing site code.
5. Limiting values
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to 3 or 2 to 3.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 3. Ordering information
Type number Package
Name Description Version
PESD2CAN - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code[1]
PESD2CAN 6R*
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
PPP peak pulse power tp=8/20s[1][2] -230W
IPP peak pulse current tp=8/20s[1][2] -5A
Per device
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
Per diode
VESD electrostatic discharge voltage IEC 61000-4-2
(contact discharge)
[1][2] -30kV
machine model [2] - 400 V
MIL-STD-883 (human
body model)
[1][2] -16kV
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 3 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
Table 7. ESD standards compliance
Standard Conditions
Per diode
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3B (human body model) > 8 kV
Fig 1. 8/20 s pulse waveform according to
IEC 61000-4-5 Fig 2. ESD pulse waveform according to
IEC 61000-4-2
001aaa631
I
PP
100 %
90 %
t
30 ns
60 ns
10 %
t
r
= 0.7 ns to 1 ns
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 4 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
6. Characteristics
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage - - 24 V
IRM reverse leakage current VRWM =24V - <1 10 nA
VBR breakdown voltage IR= 1 mA 26.2 28 30.3 V
Cddiode capacitance f = 1 MHz; VR= 0 V - 25 30 pF
VCL clamping voltage IPP =1A [1][2] --34V
IPP =5A [1][2] --41V
rdif differential resistance IR=1mA - - 300
Tamb =25C
Fig 3. Peak pulse current as a function of clamping
voltage; typical values Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical
values
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 5 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
f=1MHz
(1) Tamb = 150 C
(2) Tamb = 125 C
(3) Tamb =85C
(4) Tamb =25C
(5) Tamb =40 C
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 5. Diode capacitance as a function of reverse
voltage; typical values Fig 6. Reverse current as a function of reverse
voltage; typical values
Tamb = 150 C
IR is less than 1 nA at 55 C and 25 C.
Fig 7. Reverse voltage as a function of reverse
leakage current; typical values Fig 8. V-I characteristics for a bidirectional ESD
protection diode
006aaa676
V
CL
V
BR
V
RWM
V
CL
V
BR
V
RWM
I
RM
I
RM
I
R
I
R
I
PP
I
PP
+
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 6 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
Fig 9. ESD clamping test setup and waveforms
006aaa941
50 Ω
RZ
CZ
D.U.T.
(Device
Under
Test)
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network) clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network), Pin 1 to 3
unclamped 8 kV ESD pulse waveform
(IEC 61000-4-2 network) clamped 8 kV ESD voltage waveform
(IEC 61000-4-2 network), Pin 1 to 3
450 Ω
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
vertical scale = 10 A/div
horizontal scale = 15 ns/div vertical scale = 25 V/div
horizontal scale = 100 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
vertical scale = 25 V/div
horizontal scale = 100 ns/div
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 7 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
7. Application information
The PESD2CAN is designed for the protection of two automotive CAN bus lines from the
damage caused by ESD and surge pulses. The PESD2CAN can be used for both,
high-speed CAN bus and fault-tolerant CAN bus protection. The PESD2CAN provides a
surge capability of up to 230 W per line for an 8/20 s waveform.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESD2CAN as close to the input terminal or connector as possible.
2. Minimize the path length between the PESD2CAN and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 10. Typical application: ESD protection of two automotive CAN bus lines
006aaa942
CG
CAN BUS
TRANSCEIVER CAN
bus
PESD2CAN
SPLIT
2
3
1
RT/2
RT/2
CANH
CANL Common
mode choke
(optional)
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 8 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 11. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
PESD2CAN SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 9 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
11. Soldering
Fig 12. Reflow soldering footprint SOT23 (TO-236AB)
Fig 13. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 10 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD2CAN v.2 20120927 Product data sheet - PESD2CAN v.1
Modifications: Section 1.2 “Features and benefits: updated
Table 6 ESD maximum ratings: corrected Tamb minimum value
Table 7 ESD standards compliance: updated
Section 8 “Test information: added
Section 11 Soldering: added
Section 13 Legal information: updated
PESD2CAN v.1 20061222 Product data sheet - -
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 11 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
PESD2CAN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 27 September 2012 12 of 13
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PESD2CAN
CAN bus ESD protection diode
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 September 2012
Document identifier: PESD2CAN
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 7
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information . . . . . . . . . . . . . . . . . . . . . 8
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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