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NFL21SPyyyX1Cyy Spec Datasheet

Murata Electronics North America

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Datasheet

Spec. No. JENF243D-0006L-01 P 1/ 8
MURATA MFG.CO., LTD.
Reference Only
Chip EMIFIL® LC Combined Monolithic
NFL21SP□□□X1C□□ Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL® LC Combined Monolithic Type NFL21S Series.
2. Part Numbering
NF L 21 SP 106 X 1C 3 D
Product ID Structure Dimension Features Cut-off Characteristics Rated Electrode Packaging Code
(L×W) Frequency Voltage (3,7 : Sn plating) (D : Taping / B : Bulk)
3. Rating
Customer
Part Number
MURATA
Part Number
Cut-off
Frequency
[MHz]
Capacitance
[pF]
Inductance
(L)
[nH]
DC
Resistance
[Ω max.]
Rated
Current
[mA(DC)]
Insulation
Resistance
[MΩ min.]
Rated
Voltage
[V(DC)]
Withstanding
Voltage
[V(DC)]
NFL21SP106X1C3D 10 670±20% 680±20%
8.5 100
1000 16 50
NFL21SP106X1C3B
NFL21SP206X1C7D 20 240±20% 700±20%
NFL21SP206X1C7B
NFL21SP506X1C3D 50 84±20% 305±20% 3.5
150
NFL21SP506X1C3B
NFL21SP706X1C3D 70 76±20% 185±20% 3.0
NFL21SP706X1C3B
NFL21SP107X1C3D 100 44±20% 135±20%
2.0 200
NFL21SP107X1C3B
NFL21SP157X1C3D 150 28±20% 128±20%
NFL21SP157X1C3B
NFL21SP207X1C3D 200 22±20% 72±20% 1.5 250
NFL21SP207X1C3B
NFL21SP307X1C3D 300 19±10% 45±10%
1.2 300
NFL21SP307X1C3B
NFL21SP407X1C3D 400 16±10% 34±10%
NFL21SP407X1C3B
NFL21SP507X1C3D 500 12±10% 31±10%
NFL21SP507X1C3B
Operating Temperature : -55°C to +125°C (Includes self-heating.)
Storage Temperature : -55°C to +125°C
4. Standard Testing Condition
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. / 15 °C to 35 °C Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.009g
Input
(1)
Out put
(2)
GND
(3)
No Polarity
:Electrode
(in mm)
(2)
(1) (3)
1.25±0.1
0.85±0.1
2.0±0.2
0.3±0.2 0.6±0.2 0.3±0.2 1.25±0.1
0.4±0.2
0.25±0.2
(2)
Spec. No. JENF243D-0006L-01 P 2/ 8
MURATA MFG.CO., LTD.
Reference Only
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking
7. Electrical Performance
No. Item Specification Test Method
7.1 Capacitance
(Cap.)
Meet item 3. · Frequency : 1±0.1MHz
· Voltage : 1±0.2V(rms)
7.2 Inductance
(L)
· Frequency
Cut-off Frequency 20~500MHz : 10±1MHz
Cut-off Frequency 10MHz : 1±0.1MHz
· Voltage : 1±0.2V(rms)
7.3 DC Resistance
(Rdc)
Measured with 10mA max.
Measured between terminal (1)-(3). (ref. Item5)
7.4 Insulation
Resistance(I.R.)
· Voltage : Rated Voltage
· Time : 1 minutes max.
7.5 Withstanding
Voltage
Products shall not be damaged. · Test Voltage : 50V(DC)
· Time : 1 to 5 s
· Charge Current : 50 mA max.
8. Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Slide
Calipers.
8.2 Solderability Electrodes shall be at least 90%
covered with new solder coating.
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150 ± 10°C, 60 to 90s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 240 ± 3°C
· Immersion Time : 3±1 s
· Immersion and emersion rates : 25mm / s
8.3 Resistance to
soldering heat
Meet Table 1.
Table 1
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150 ± 10°C, 60 to 90s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 270 ± 5°C
· Immersion Time : 10 ± 1 s
· Immersion and emersion rates : 25mm / s
· Then measured after exposure in the room
condition for 24±2 hours.
Appearance No damaged
Cap. Change within ± 5%
L Change within ± 5%
I.R. meet item 3
Spec. No. JENF243D-0006L-01 P 3/ 8
MURATA MFG.CO., LTD.
Reference Only
No. Item Specification Test Method
8.4 Bending
Strength
Meet Table 2.
Table 2
It shall be soldered on the glass-epoxy substrate
(t = 1.0mm).
· Deflection : 2 mm
· Keeping Time : 30 s
(in mm)
8.5 Drop Products shall be no failure after
tested.
It shall be dropped on concrete or steel board.
· Method : Free fall
· Height : 75 cm
· Attitude from which the product is dropped
: 3 directions
· The Number of Time : 3 times for each direction
(Total 9 times)
8.6 Bonding
Strength
The electrodes shall be no failure after
tested.
It shall be soldered on the glass-epoxy substrate.
· Applying Force (F) : 9.8 N
· Applying Time : 30 s
(in mm)
8.7 Vibration Meet Table 1. It shall be soldered on the glass-epoxy substrate.
· Oscillation Frequency : 10 to 55Hz for 1 minute
· Double Amplitude : 1.5 mm
· Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
9. Environment Performance
It shall be soldered on the glass-epoxy substrate.
No. Item Specification Test Method
9.1 Temperature
Cycling
Meet Table 1. · 1 Cycle
1 step: -55 ±
03
°C / 30 ±
30
min
2 step: Room Temperature / within 3 min
3 step: +125 ±
30
°C / 30 ±
30
min
4 step: Room Temperature / within 3 min
· Total of 10 cycles
· Then measured after exposure in the room
condition for 24±2 hours.
9.2 Humidity · Temperature : 40 ± 2 °C
· Humidity : 90 to 95%(RH)
· Time : 500±
240
hours
· Then measured after exposure in the room
condition for 24±2 hours.
9.3 Heat Life · Temperature : 125 ± 2 °C
· Test Voltage : Rated Voltage × 200%
· Charge Current : 50 mA max.
· Time : 1000 ±
480
hours
· Then measured after exposure in the room
condition for 24±2 hours.
Appearance No damaged
Cap. Change within ± 5%
45
R230
F
Deflection
45 Product
Pressure jig
0.6
0.8
1.6
1.0
Spec. No. JENF243D-0006L-01 P 4/ 8
MURATA MFG.CO., LTD.
Reference Only
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide paper tape)
(in mm)
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Top tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Top Tape and Bottom Tape
Top tape 5N min.
Bottom tape
10.4. Peeling off force of top tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
F
165 to 180 degree Top tape
Bottom tape Base tape
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
1.1max.
Direction of feed
Sporocket Hole
φ
1.
4.0±0.1 2.0±0.1
3.5±0.1 1.75±0.1
8.0±0.3
0.1
0
1.55±0.2
4.0±0.1
2.3± 0.2
0.1
3.5±0.05
2.0±0.05
Spec. No. JENF243D-0006L-01 P 5/ 8
MURATA MFG.CO., LTD.
Reference Only
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS marking» ROHS – Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
10.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
Side on which chips are mounted
(in mm)
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
Small diameter thru hole
φ
0.4
Resist
Copper foil pattern
No pattern
0.6
1.4
2.6
0.8
2.3
0.6
1.9
W
D
Label
H
Spec. No. JENF243D-0006L-01 P 6/ 8
MURATA MFG.CO., LTD.
Reference Only
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
Products shall be located in the sideways
direction (Length:a
<
b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be
diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
Poor example
Good example
b
a
Spec. No. JENF243D-0006L-01 P 7/ 8
MURATA MFG.CO., LTD.
Reference Only
13.5. Reflow Soldering
1) Soldering paste printing for reflow Standard printing pattern of solder paste.
· Standard thickness of solder paste: 100µm to 150µm.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land
dimensions.
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 245°C ± 3°C 260°C , 10s
Cycle of reflow 2 times 2 times
13.6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min Soldering iron output : 30W max.
Tip temperature : 350°C max. Tip diameter : φ3mm max.
Soldering time : 3(+1,-0) s Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ceramic material due to the thermal shock.
13.7. Solder Volume
Solder shall be used not to be exceeded as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
2.6
0.6
1.4
0.8
1.9
0.6
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
60s
60s max.
180
150
Temp.
Time.(s)
C)
Upper Limit
Recommendable
1/3T
t
T(T:Chip thickness)
t
Recommendable
Upper Limit
Spec. No. JENF243D-0006L-01 P 8/ 8
MURATA MFG.CO., LTD.
Reference Only
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power : 20W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.10. Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C, Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14. ! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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