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Chip Quik Inc. TC1-10G

Supplier: Chip Quik Inc.

Subtitle: Heat Sink Compound
Description: High Density Thermal Paste. White, non-curing and non-flowing thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides high thermal conductivity, low bleed and high temperature stability.

Category: Thermal ProductsAdhesives, Epoxies, Greases, Pastes